Allring Tech (TWSE: 6187), a backend semiconductor equipment provider, is accelerating its global expansion. Its U.S. subsidiary, All Ring Tech USA LLC, will make its debut with an independent booth at SEMICON West 2025, showcasing the company’s latest optoelectronic integration and automated process equipment. The exhibition underscores Allring’s growing technological depth and its commitment to expanding its global presence in the semiconductor supply chain.
Centered on the theme of “Optoelectronic Integration and Smart Manufacturing,” Allring will present its proprietary optical coupling and precision dispensing systems. Its latest-generation optical coupling platform (CoWoS IC & FAU) integrates a high-precision six-axis alignment stage with advanced vision recognition algorithms, enabling fast and stable automated coupling between fiber array units (FAU) and photonic chips. The system achieves nanometer-level alignment accuracy, meeting the demands of next-generation high-speed transmission and silicon photonics packaging.
In addition, Allring will introduce its Panel Dispenser for Underfill (600 × 600 mm), designed for large-format substrate packaging. The system features multi-valve synchronized dispensing, closed-loop flow control, and temperature uniformity management, significantly improving process stability and yield for PLP and SoIC applications.
To address the growing need for high thermal conductivity materials and hybrid bonding processes, Allring will also showcase its advanced thermal packaging solutions. These include a newly developed dispensing module that supports various thermal interface materials (TIM) and enables high-precision coating for hybrid bonding processes, enhancing both thermal performance and reliability in advanced packaging.
Allring noted that the rapid advancement of AI and high-performance computing (HPC) is driving increased demand for high-speed alignment, precision control, and intelligent manufacturing solutions. By establishing operations in the United States, the company aims to strengthen collaboration with North American foundries, OSATs, and material suppliers, while maintaining Taiwan as its core R&D hub to connect Asia with global markets.
“Global expansion for Allring is not only about market growth, but also about extending our technological partnerships,” said Cheng-Yen Chiang, Vice President of Allring Tech. “We look forward to working with international partners to bring Taiwan’s automation and optoelectronic integration technologies to the forefront of advanced packaging worldwide.”