Comprehensive 2D AOI solutions across multiple process stages for quality and production stability.

Allring focuses on 2D Automated Optical Inspection (AOI), providing integrated inspection solutions across different packaging process stages—from in-line inspection to final product verification.

🔷 Multi-Process Inspection Coverage

• Die attach inspection
• Post-dispensing inspection
• BGA / solder ball inspection
• 6-side final product inspection

🔷 Inspection Scope

• Adhesive defects (overflow, insufficient, misalignment)
• Surface defects (scratch, contamination, chipping)
• Solder defects (missing, bridging, shift)
• Component defects (missing, misplacement)

🔷 System Capability

• High-precision XY(Z) positioning (±20 μm level)
• Multi-light source configuration
• SECS/GEM and customizable HMI
• Integration with loader, unloader, and robotic handling

🔷 Process Integration & Efficiency

• In-line inspection with real-time feedback
• Final quality assurance before shipment
• Reduced manual inspection and improved consistency