High-Performance Thermal Interface Material Process for Reliable High-Power Packaging

With the rapid advancement of AI and high-performance computing (HPC), chip power density continues to increase, making thermal management a critical challenge in advanced packaging.

Thermal Interface Materials (TIM) serve as the key thermal bridge between chips and heat dissipation components. The quality of the TIM process directly impacts overall thermal resistance and system reliability.

🔷 Versatile TIM Material Capability

Supporting a wide range of TIM materials to meet diverse packaging and application requirements:

• Film TIM
• Metal TIM
• Paste TIM

🔷 High-Precision Material Control

Ensuring uniform distribution and consistent thickness through precise process control:

• Micron-level thickness control
• High-uniformity coating and bonding
• Material flow and gap-filling control

🔷 Process Stability & Quality Control

Addressing key challenges in thermal processes with stable and scalable solutions:

• Void control
• Interface bonding quality
• Process consistency and repeatabilit